June 25, 2008
IC Spectrum has entered into a memorandum of understanding with a Singapore company for the formation of a new joint venture subsidiary. |
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June 1, 2008
IC Spectrum appoints Ms. MayLan Lim as Vice President of Finance and Business Development. |
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May 16, 2008
A funding agreement has been signed between IC Spectrum and a private equity group for 150M USD in equity investment in IC Spectrum. |
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| Jan 28, 2008 A major international bank has completed its initial due diligence on IC Spectrum and has delivered a formal term sheet for debt financing for up to 222.5M USD for the IC Spectrum 8" wafer fab project. |
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May 10, 2007
Government Bidding Network posts IC Spectrum's facility construction bidding information. |
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Apr 30, 2007
China's National Development and Reform Commission approves IC Spectrum's 8" wafer fab project in Kunshan, China. |
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Nov 19, 2006
China's State Ministry of Land and Resource approves the use of 130,000 square meters of land for IC Spectrum's phase 1. |
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Nov 14, 2006
IC Spectrum receives the approval of its environmental impact assessment from China's State Environmental Review Board. |
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Nov 1, 2006
Shanghai BaoYe construction company completes the piling for IC Spectrum's first wafer fab. |
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Jul 9, 2006
Vibration consultant Colin Gorden began vibration analysis for ICS site. |
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Jul 6, 2006
Shanghai BaoYe construction company started foundation test piling. |
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Jun 24, 2006
The geo-technical survey was completed by the Southwest Geo-investigation Institute. |
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Jun 19, 2006
IC Spectrum issues letter of award for its ultra pure water and waste water treatment package to Christ Ultra-pure Water, A.G. |
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May 23, 2006
IC Spectrum has contracted M+W Zander to provide design services for IC Spectrum's first fab in Kunshan, China. |
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Apr 18, 2006
IC Spectrum Announces Technology Cooperation with Toshiba. |
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Feb 17, 2006
IC Spectrum become a member of Suzhou Integrated Circuit Industry Association. |
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Nov 18, 2005
IC Spectrum (Kunshan) Co., Ltd. Groundbreaking Ceremony. |
